System-In-Package components support custom control designs for high power electronics Equipment designed for the management of electric power grid infrastructure is increasingly critical to meeting the need for clean and reliable electric power. High power electronics at the level of multi-megawatt switching, generation and load balancing, storage, motor drives, and other distribution management demand sophisticated

Allied Component Works spins a clean and simple development board for the OSD32MP15x SIP processor from Octavo Systems The latest system-in-package (SIP) processor from Octavo Systems, the OSD32MP15x, offers a complex computing platform neatly integrated in a tiny ball grid array (BGA) package that easily supports cost effective low density designs.  Based on STMicroelectronics STM32MP1